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| Manufacturer Part Number: | 24LC256-E/MF |
|---|---|
| Manufacturer: | Microchip Technology |
| Product Category: | Memory |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC EEPROM 256KBIT 400KHZ 8DFNS |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | 24LC256-E/MF Datasheet |
| Internal Part Number | 898-24LC256-E/MF | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | I2C Serial EEPROM | |
| PCN Assembly/Origin | 8L SOIJ Package/Plating 31/Jul/2013 Mold Compound Qualification 07/Oct/2014 Lead Frame Update 16/Feb/2015 Fabrication Site Addition 04/Sep/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Manufacturer | Microchip Technology | |
| Series | - | |
| Packaging | Tube | |
| Part Status | Active | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 256K (32K x 8) | |
| Speed | 400kHz | |
| Interface | I²C, 2-Wire Serial | |
| Voltage - Supply | 2.5 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Package / Case | 8-VDFN Exposed Pad | |
| Supplier Device Package | 8-DFN-S (6x5) | |
| Standard Package | 60 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | 24LC256-E/MF | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
24LC256-E/MF is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of 24LC256-E/MF is new and unused, you can buy 24LC256-E/MF Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 24LC256-E/MF.
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