Manufacturer Part Number: | 74LVC2G38DP,125 |
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Manufacturer: | NXP Semiconductors |
Product Category: | Logic - Gates and Inverters |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | NAND Gate IC 2 Channel Open Drain 8-TSSOP |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 74LVC2G38DP,125 Datasheet |
Internal Part Number | 898-74LVC2G38DP,125 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Logic Packages | |
Online Catalog | 74LVC | |
Category | Integrated Circuits (ICs) | |
Family | Logic - Gates and Inverters | |
Manufacturer | NXP Semiconductors | |
Series | 74LVC | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Logic Type | NAND Gate | |
Number of Circuits | 2 | |
Number of Inputs | 2 | |
Features | Open Drain | |
Voltage - Supply | 1.65 V ~ 5.5 V | |
Current - Quiescent (Max) | 40µA | |
Current - Output High, Low | -, 32mA | |
Logic Level - Low | 0.7 V ~ 0.8 V | |
Logic Level - High | 1.7 V ~ 2 V | |
Max Propagation Delay @ V, Max CL | 1.5ns @ 5V, 50pF | |
Operating Temperature | -40°C ~ 125°C | |
Mounting Type | Surface Mount | |
Supplier Device Package | 8-TSSOP | |
Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | |
Standard Package | 3,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 74LVC2G38DP,125 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
74LVC2G38DP,125 is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of 74LVC2G38DP,125 is new and unused, you can buy 74LVC2G38DP,125 NXP Semiconductors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 74LVC2G38DP,125.
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