| Manufacturer Part Number: | 93LC56T/SN |
|---|---|
| Manufacturer: | Microchip Technology |
| Product Category: | Memory |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC EEPROM 2KBIT 2MHZ 8SOIC |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | 93LC56T/SN Datasheet |
| Internal Part Number | 898-93LC56T/SN | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | PdCu Bond Wire Update 21/Sep/2015 | |
| PCN Assembly/Origin | Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
| PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Manufacturer | Microchip Technology | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Not For New Designs | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 2K (256 x 8, 128 x 16) | |
| Speed | 1MHz, 2MHz | |
| Interface | Microwire, 3-Wire Serial | |
| Voltage - Supply | 2.5 V ~ 5.5 V | |
| Operating Temperature | 0°C ~ 70°C (TA) | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC | |
| Standard Package | 3,300 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | 93LC56T/SN | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
93LC56T/SN is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of 93LC56T/SN is new and unused, you can buy 93LC56T/SN Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 93LC56T/SN.
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