Manufacturer Part Number: | A2F060M3E-1FGG256 |
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Manufacturer: | Microsemi Corporation |
Product Category: | Embedded - System On Chip (SoC) |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 128KB 16KB 100MHz 256-FBGA (17x17) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | A2F060M3E-1FGG256 Datasheet |
Internal Part Number | 898-A2F060M3E-1FGG256 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Other | SmartFusion Fixes 11/Mar/2015 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Manufacturer | Microsemi Corporation | |
Series | SmartFusion® | |
Packaging | Tray | |
Part Status | Active | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 128KB | |
MCU RAM | 16KB | |
Peripherals | DMA, POR, WDT | |
Connectivity | EBI/EMI, I²C, SPI, UART/USART | |
Speed | 100MHz | |
Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FBGA (17x17) | |
Number of I/O | MCU - 26, FPGA - 66 | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | A2F060M3E-1FGG256 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
A2F060M3E-1FGG256 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of A2F060M3E-1FGG256 is new and unused, you can buy A2F060M3E-1FGG256 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for A2F060M3E-1FGG256.
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