Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | AGL600V2-FGG256 |
|---|---|
| Manufacturer: | Microsemi Corporation |
| Product Category: | Embedded - FPGAs (Field Programmable Gate Array) |
| Available Quantity: | 9040 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC FPGA 177 I/O 256FBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | AGL600V2-FGG256 Datasheet |
| Internal Part Number | 898-AGL600V2-FGG256 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Online Catalog | IGLOO/e | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Manufacturer | Microsemi Corporation | |
| Series | IGLOO | |
| Part Status | Active | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 13824 | |
| Total RAM Bits | 110592 | |
| Number of I/O | 177 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.14 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C (TA) | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Standard Package | 90 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | AGL600V2-FGG256 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
AGL600V2-FGG256 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of AGL600V2-FGG256 is new and unused, you can buy AGL600V2-FGG256 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for AGL600V2-FGG256.
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