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DSPIC30F3013T-30I/ML

DSPIC30F3013T-30I/ML
Manufacturer Part Number:DSPIC30F3013T-30I/ML
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:dsPIC dsPIC™ 30F Microcontroller IC 16-Bit 30 MIPs 24KB (8K x 24) FLASH 44-QFN (8x8)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: DSPIC30F3013T-30I/ML Datasheet
DSPIC30F3013T-30I/ML´s Parameters
Internal Part Number898-DSPIC30F3013T-30I/ML
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesAsynchronous Stimulus
Bluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationPlating 04/Jun/2013
Wire Bond Chg Qual 19/Jul/2016
PCN Assembly/OriginQualification Assembly Site 01/May/2014
Qualification Report 01/Jul/2014
PCN PackagingReel Design Update 07/May/2015
Label and Packing Changes 23/Sep/2015
EDA / CAD Models Download from Accelerated Designs
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesdsPIC™ 30F
PackagingTape & Reel (TR)
Part StatusActive
Core ProcessordsPIC
Core Size16-Bit
Speed30 MIPs
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of I/O20
Program Memory Size24KB (8K x 24)
Program Memory TypeFLASH
EEPROM Size1K x 8
RAM Size2K x 8
Voltage - Supply (Vcc/Vdd)2.5 V ~ 5.5 V
Data ConvertersA/D 10x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case44-VQFN Exposed Pad
Supplier Device Package44-QFN (8x8)
Standard Package 1,600
Weight0.001 KG
ApplicationEmail for details
Replacement PartDSPIC30F3013T-30I/ML
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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