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DSPIC33EP256MC506T-E/MR

DSPIC33EP256MC506T-E/MR
Manufacturer Part Number:DSPIC33EP256MC506T-E/MR
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 60 MIPs 256KB (85.5K x 24) FLASH 64-QFN (9x9)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):Obsolete / Discontinued
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: DSPIC33EP256MC506T-E/MR Datasheet
DSPIC33EP256MC506T-E/MR´s Parameters
Internal Part Number898-DSPIC33EP256MC506T-E/MR
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationMultiple Devices Datasheet Revision 20/Aug/2013
Multiple Devices Errata Revision 20/Aug/2013
Errata Document Revision 27/Sep/2013
Errata Update 06/Feb/2014
Errata/Datasheet Update 10/Apr/2014
Errata/Datasheet Update 07/Aug/2014
Mold Compound Update 31/Oct/2014
Errata/Datasheet Update 23/Dec/2014
PCN Assembly/OriginAssembly Site Addition 22/Jun/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesdsPIC™ 33EP
PackagingTape & Reel (TR)
Part StatusObsolete
Core ProcessordsPIC
Core Size16-Bit
Speed60 MIPs
ConnectivityCAN, I²C, IrDA, LIN, QEI, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O53
Program Memory Size256KB (85.5K x 24)
Program Memory TypeFLASH
EEPROM Size-
RAM Size16K x 16
Voltage - Supply (Vcc/Vdd)3 V ~ 3.6 V
Data ConvertersA/D 16x10b/12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Package / Case64-VFQFN Exposed Pad
Supplier Device Package64-QFN (9x9)
Standard Package 3,300
Weight0.001 KG
ApplicationEmail for details
Replacement PartDSPIC33EP256MC506T-E/MR
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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