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MSP430F2252TRHARQ1

MSP430F2252TRHARQ1
Manufacturer Part Number:MSP430F2252TRHARQ1
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:MSP430 Automotive, AEC-Q100, MSP430F2 Microcontroller IC 16-Bit 16MHz 16KB (16K x 8 + 256B) FLASH 40-VQFN (6x6)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: MSP430F2252TRHARQ1 Datasheet
MSP430F2252TRHARQ1´s Parameters
Internal Part Number898-MSP430F2252TRHARQ1
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesMicrocontrollers: SYS/BIOS: Introduction to Real-Time Operating Systems and SYS/BIOS
Communication Solutions for Industrial Automation
Design ResourcesDevelopment Tool Selector
Manufacturer Product PageMSP430F2252TRHARQ1 Specifications
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerT I
SeriesAutomotive, AEC-Q100, MSP430F2
PackagingTape & Reel (TR)
Part StatusActive
Core ProcessorMSP430
Core Size16-Bit
Speed16MHz
ConnectivityI²C, IrDA, LIN, SCI, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of I/O32
Program Memory Size16KB (16K x 8 + 256B)
Program Memory TypeFLASH
EEPROM Size-
RAM Size512 x 8
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
Data ConvertersA/D 12x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Package / Case40-VFQFN Exposed Pad
Supplier Device Package40-VQFN (6x6)
Standard Package 2,500
Weight0.001 KG
ApplicationEmail for details
Replacement PartMSP430F2252TRHARQ1
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

MSP430F2252TRHARQ1 is in stock for immediate shipping now. We are the distributor of T-I all series components. The condition of MSP430F2252TRHARQ1 is new and unused, you can buy MSP430F2252TRHARQ1 T-I with us at a very low price and quick delivery.

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