Manufacturer Part Number: | OPA2677HG3 |
---|---|
Manufacturer: | T-I |
Product Category: | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | Current Feedback Amplifier 2 Circuit 8-HSOP |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 2 (1 Year) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | OPA2677HG3 Datasheet |
Internal Part Number | 898-OPA2677HG3 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Manufacturer | T I | |
Series | SpeedPlus™ | |
Packaging | Tube | |
Part Status | Obsolete | |
Amplifier Type | Current Feedback | |
Number of Circuits | 2 | |
Output Type | - | |
Slew Rate | 2000 V/µs | |
Gain Bandwidth Product | 2GHz | |
-3db Bandwidth | 250MHz | |
Current - Input Bias | 10µA | |
Voltage - Input Offset | 1mV | |
Current - Supply | 18mA | |
Current - Output / Channel | 500mA | |
Voltage - Supply, Single/Dual (±) | 5 V ~ 12 V, ±2.5 V ~ 6 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | |
Supplier Device Package | 8-HSOP | |
Standard Package | 100 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | OPA2677HG3 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
OPA2677HG3 is in stock for immediate shipping now. We are the distributor of T-I all series components. The condition of OPA2677HG3 is new and unused, you can buy OPA2677HG3 T-I with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for OPA2677HG3.
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