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PIC16LF1718T-I/MV

PIC16LF1718T-I/MV
Manufacturer Part Number:PIC16LF1718T-I/MV
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:PIC PIC® XLP™ 16F Microcontroller IC 8-Bit 32MHz 28KB (16K x 14) FLASH 28-UQFN (4x4)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: PIC16LF1718T-I/MV Datasheet
PIC16LF1718T-I/MV´s Parameters
Internal Part Number898-PIC16LF1718T-I/MV
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Featured ProductPIC16(L)F170x/171x 8-bit MCU Family
PCN Design/SpecificationMold Compound Update 31/Oct/2014
Lead Frame Update 16/Feb/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
PCN OtherCuPdAu Bond Wire 24/Apr/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesPIC® XLP™ 16F
PackagingTape & Reel (TR)
Part StatusActive
Core ProcessorPIC
Core Size8-Bit
Speed32MHz
ConnectivityI²C, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of I/O24
Program Memory Size28KB (16K x 14)
Program Memory TypeFLASH
EEPROM Size-
RAM Size2K x 8
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
Data ConvertersA/D 17x10b, D/A 1x5b, 1x8b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case28-UFQFN Exposed Pad
Supplier Device Package28-UQFN (4x4)
Standard Package 3,300
Weight0.001 KG
ApplicationEmail for details
Replacement PartPIC16LF1718T-I/MV
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

PIC16LF1718T-I/MV is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of PIC16LF1718T-I/MV is new and unused, you can buy PIC16LF1718T-I/MV Microchip Technology with us at a very low price and quick delivery.

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