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PIC24FJ64GB406-I/MR

PIC24FJ64GB406-I/MR
Manufacturer Part Number:PIC24FJ64GB406-I/MR
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:PIC PIC® XLP™ 24F Microcontroller IC 16-Bit 32MHz 64KB (22K x 24) FLASH 64-QFN Exposed Pad (9x9)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: PIC24FJ64GB406-I/MR Datasheet
PIC24FJ64GB406-I/MR´s Parameters
Internal Part Number898-PIC24FJ64GB406-I/MR
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesBluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationPIC24FJ256GA412/PIC24FJ256GB412 Data Sheet Update 06/Oct/2015
PIC24FJ256GB412 23/Jun/2016
PCN PackagingLabel and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesPIC® XLP™ 24F
PackagingTube
Part StatusActive
Core ProcessorPIC
Core Size16-Bit
Speed32MHz
ConnectivityI²C, IrDA, LIN, PMP/PSP, SPI, UART/USART, USB OTG
PeripheralsBrown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O52
Program Memory Size64KB (22K x 24)
Program Memory TypeFLASH
EEPROM Size-
RAM Size8K x 8
Voltage - Supply (Vcc/Vdd)2 V ~ 3.6 V
Data ConvertersA/D 16x10b/12b, D/A 1x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case64-VFQFN Exposed Pad
Supplier Device Package64-QFN Exposed Pad (9x9)
Standard Package 40
Weight0.001 KG
ApplicationEmail for details
Replacement PartPIC24FJ64GB406-I/MR
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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