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PIC32MX470F512LT-V/PT

PIC32MX470F512LT-V/PT
Manufacturer Part Number:PIC32MX470F512LT-V/PT
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit 80MHz 512KB (512K x 8) FLASH 100-TQFP (12x12)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: PIC32MX470F512LT-V/PT Datasheet
PIC32MX470F512LT-V/PT´s Parameters
Internal Part Number898-PIC32MX470F512LT-V/PT
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesBluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationErrata/Datasheet Update 05/Jun/2014
Errata/Datasheet Update 10/Feb/2015
Errata/Datasheet Update 25/Jun/2015
PIC32MX330,350,370,430,450,470 Datasheet Rev 2/Nov/2015
PCN Assembly/OriginQualification Copper Wire 10/Feb/2014
Qualification Copper Wire 15/May/2014
Qualification Lead-Frame Paddle 20/Oct/2014
PCN PackagingReel Design Update 07/May/2015
Label and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesPIC® 32MX
PackagingTape & Reel (TR)
Part StatusActive
Core ProcessorMIPS32® M4K™
Core Size32-Bit
Speed80MHz
ConnectivityI²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O83
Program Memory Size512KB (512K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size128K x 8
Voltage - Supply (Vcc/Vdd)2.3 V ~ 3.6 V
Data ConvertersA/D 28x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Package / Case100-TQFP
Supplier Device Package100-TQFP (12x12)
Standard Package 1,200
Weight0.001 KG
ApplicationEmail for details
Replacement PartPIC32MX470F512LT-V/PT
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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