Manufacturer Part Number: | XC7K70T-3FBG676E |
---|---|
Manufacturer: | Xilinx Inc. |
Product Category: | Embedded - FPGAs (Field Programmable Gate Array) |
Available Quantity: | 9082 Pieces |
Unit Price: | Quote by Email |
Description: | IC FPGA 300 I/O 676FCBGA |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | XC7K70T-3FBG676E Datasheet |
Internal Part Number | 898-XC7K70T-3FBG676E | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 | |
PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 | |
Online Catalog | Kintex™ -7 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Manufacturer | Xilinx Inc. | |
Series | Kintex-7 | |
Part Status | Active | |
Number of LABs/CLBs | 5125 | |
Number of Logic Elements/Cells | 65600 | |
Total RAM Bits | 4976640 | |
Number of I/O | 300 | |
Number of Gates | - | |
Voltage - Supply | 0.97 V ~ 1.03 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 100°C (TJ) | |
Package / Case | 676-BBGA, FCBGA | |
Supplier Device Package | 676-FCBGA (27x27) | |
Standard Package | 40 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | XC7K70T-3FBG676E | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
XC7K70T-3FBG676E is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC7K70T-3FBG676E is new and unused, you can buy XC7K70T-3FBG676E Xilinx Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for XC7K70T-3FBG676E.
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