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XC7Z030-1FBG676C

XC7Z030-1FBG676C
Manufacturer Part Number:XC7Z030-1FBG676C
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9050 Pieces
Unit Price:Quote by Email
Description:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 676-FCBGA (27x27)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):4 (72 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: XC7Z030-1FBG676C Datasheet
XC7Z030-1FBG676C´s Parameters
Internal Part Number898-XC7Z030-1FBG676C
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesPowering Series 7 Xilinx FPGAs with TI Power Management Solutions
Featured ProductZynq®-7 SoC
PCN Design/SpecificationZynq-7000 Datasheet Update 02/Jun/2014
Zynq-7000 AP Requirement 28/Sep/2015
PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
Substrate Supplier Addition 03/Nov/2014
Online Catalog Zynq™-7000
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerXilinx Inc.
SeriesZynq®-7000
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartXC7Z030-1FBG676C
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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